Burn-In/Test Ovens — Semiconductor

The Qmax High Performance Benchtop oven is specifically designed to meet the frequent air changes and tight temperature uniformity required of the ASTM 5423 Type I & Type II oven specification. A high-volume fan circulates air through perforated, stainless steel walls to create a constant horizontal airflow across all sections of the oven. The result is highly uniform airflow to easily meet ASTM 5423 Type I and II specification while tested according to ASTM 5374.

Despatch's RBC Burn-In Benchtop Ovens offer maximum flexibility for small lot qualification testing, burn-in, reliability testing, and research and development.

Despatch burn-in ovens are engineered specifically for applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices.

Despatch burn-in ovens are engineered specifically for applications such as high dissipation forward bias, high-temperature reverse bias, dynamic and static burn-in of IC, RAM, ROM, microprocessors and other semiconductor devices.